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Intel Expands 10th Gen Intel Core Mobile Processor Family, Offering Double Digit Performance Gains

Intel Corporation in August 2019 introduced eight 10th Gen Intel Core processors for modern laptop computing. The new mobile PC processors (formerly code-named “Comet Lake”) are tailor-made to deliver increased productivity and performance scaling for demanding, multithreaded workloads while still enabling thin-and-light laptop and 2 in 1 designs. (Credit: Intel Corporation)

At Hot Chips, Intel Pushes ‘AI Everywhere’

At Hot Chips 2019, Intel revealed new details of upcoming high-performance artificial intelligence (AI) accelerators: Intel® Nervana™ neural network processors, with the NNP-T for training and the NNP-I for inference.

Intel, Microsoft Research and Duality Technologies Convene AI Community for Privacy Standards

Intel, Microsoft Research* and Duality Technologies* are bringing nearly 100 security, privacy and artificial intelligence (AI) community members together to create standards for homomorphic encryption (HE)

Intel Debuts Visual Identifier for Project Athena; Verified Designs from Dell and HP

Intel announced that laptops verified through its innovation program, code-named “Project Athena,” will feature the visual identifier “Engineered for Mobile Performance.”

Innovation through Collaboration: Building Research Communities

Intel’s Work with DARPA ERI and University Partners in Brain-Inspired Computing Demonstrates the Power of Bringing Researchers Together across Disciplines and Organizations

Intel’s Pohoiki Beach, a 64-Chip Neuromorphic System, Delivers Breakthrough Results in Research Tests

Intel announced that an 8 million-neuron neuromorphic system comprising 64 Loihi research chips — codenamed Pohoiki Beach — is now available to the broader research community.

Creating New Technologies to Keep Moore’s Law Alive and Well

Robert Chau, Intel Senior Fellow in Technology Development, directs Intel’s Components Research team that invents and develops novel materials, devices, interconnects, patterning and packaging used in Intel technology. (Credit: Walden Kirsch/Intel Corporation)

Navigating the Winding Road Toward Driverless Mobility

As we all watch automakers and autonomous tech companies team up in various alliances, it’s natural to wonder about their significance and what the future will bring.

Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

This week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology.

Intel Appoints Claire Dixon as Corporate Vice President and Chief Communications Officer

Intel Corporation today announced the appointment of Claire Dixon as corporate vice president and chief communications officer (CCO), effective July 1. Dixon will oversee Intel’s global communications organization, including corporate communications and events, product public relations, employee communications and analyst relations.